Tuesday, August 24, 2010

AMAT announces FCVD product for C-free gap fill

We've been waiting on Applied Materials' new product announcement today: a new flow chemical vapor deposition (FCVD) product for Eterna that aims to replace spin-on dielectric (SOD) films as those films’ extendibility to advanced nodes is being questioned. In particular, Applied is targeting 3D memory architectures, which are in solid-state drives (SSDs) that are used in products such as iPads, netbooks, and even server farms.

ElectroIQ.com's Debra Vogler spoke with AMAT about the new product in this podcast interview.

Read the analyst takes on AMAT's flow CVD at What's inside Applied Materials' flowable CVD tool?

Stay tuned for more information, including the analysts' takes, on http://www.electroiq.com/

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